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FPGA to Gate Array ASIC Conversion - Low cost Solutions by Electronics Electronics FPGA to Gate Array Conversion FPGA to Gate Array Asic  

Electronics - FPGA to Gate Array ASIC Conversion

As one of the leading ASIC technology providers Electronics offers you: Conversions from FPGAs to Gate Array ASICs (sea-of-gates architecture). This is in particular for two reasons has the suitable Gate Array ASIC technologies, keeping up with the current technology offered by leading FPGA vendors.   has the know-how and the experience that are required to perform successful conversions from your FPGA designs into Gate Array ASICs.  

FPGA to Gate Array ASIC conversion

Why do an FPGA conversion? Lower Unit cost An ASIC is much less expensive on a per-piece basis than a comparable FPGA device. If you are working on a product that will see large volumes in production, the cost savings can be significant. Even lower-volume production can realize substantive cost savings. It is not atypical for the break-even pont to occur at volumes as low as 300 units, while most breah even at volumes under 1000 units. Lower Power Most FPGAs use active elements to configure theri programmable intercont. ASIC intercont is actual meta and uses no active elements. Additionally, significant areas of the FPGA are unused but still consume power. The finer-grained logic elements of an ASIC allow for lower drieve in areas of the design that do not requiere iit, as determined by the device timing constraints. As a general guideline, you can expect a design implemented in an FPGA to consume roughly three times the power of the same design implemented in ASIC technology. Higher Performance The intercont delays in an ASIC are much less than in an FPGA, due to the more efficient all-metal routing structure that allows higher system clock speeds and device throughput. Higher Integration The higher-densitiy efficiency of ASIC Technology allows you to combine multiple FPGAs and glue logic into a single ASIC to save board area, and to simplify assembly and testing of your product. You can even develop multi-mode ASICs that combine two or more complete designs into the same package. This technique will result in lower NRE costs compared to a two-chip solution, and help to increase volumes, which can result in a lower unit cost. Smaller Packages - Packaging Solutions from Electronics Duet to their large die size and associated large heat dissipation requirements, FPGAs with higher gate counts require large packages with enhanced thermal capabilities. These packages foten include many more I/O pins than your design actualla needs, and may require external heat sinks or fans to meet temperature constraints. An ASIC solution allows you to match the I/O and power requirements of your design with the appropriate size and type of package. This option can save board real estate, further reduce the cost of the ASIC, simplify board layout and routing, reduce or eliminate the need for heat sinks and additional cooling, and improve the manufacturability and reliability of your product. individual solutions asic solutions FPGA development (field programmable gate array) complete synthesis service FPGA conversion virtual prototyping Asic FPGA OpenCAD™ design environment chip design DFT services (Design for Test) ASIC design FPGA design Asic design services FPGA development ISSP (Instant Silicon Solution Platform) FPGA design services ASIC Packaging Services FPGA to Gate Array conversion Packaging Services     nedesuk2 Elektronik Prozessor
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