FPGA to Gate
Array ASIC Conversion - Low cost Solutions by Electronics
FPGA to Gate
FPGA to Gate Array Asic
FPGA to Gate Array ASIC Conversion
As one of the leading ASIC technology
providers Electronics offers you:
Conversions from FPGAs to
Gate Array ASICs (sea-of-gates architecture).
This is in particular for two reasons
has the suitable
Gate Array ASIC technologies, keeping up with the current
technology offered by leading FPGA vendors.
has the know-how
and the experience that are required to perform successful
conversions from your FPGA designs into Gate Array ASICs.
FPGA to Gate Array ASIC conversion
Why do an FPGA conversion?
Lower Unit cost
An ASIC is much less expensive on a
per-piece basis than a comparable FPGA device. If you are working
on a product that will see large volumes in production, the cost savings
can be significant. Even lower-volume production can realize substantive
cost savings. It is not atypical for the break-even pont to occur at
volumes as low as 300 units, while most breah even at volumes under 1000
Most FPGAs use active elements to configure
theri programmable intercont. ASIC intercont is actual meta and uses
no active elements. Additionally, significant areas of the FPGA are unused
but still consume power. The finer-grained logic elements of an ASIC allow
for lower drieve in areas of the design that do not requiere iit, as
determined by the device timing constraints.
As a general guideline, you can expect a
design implemented in an FPGA to consume roughly three times the power of
the same design implemented in ASIC technology.
The intercont delays in an ASIC are much
less than in an FPGA, due to the more efficient all-metal routing
structure that allows higher system clock speeds and device throughput.
The higher-densitiy efficiency of ASIC
Technology allows you to combine multiple FPGAs and glue logic into a
single ASIC to save board area, and to simplify assembly and testing of
your product. You can even develop multi-mode ASICs that combine two or
more complete designs into the same package. This technique will result in
lower NRE costs compared to a two-chip solution, and help to increase
volumes, which can result in a lower unit cost.
Smaller Packages - Packaging Solutions
Duet to their large die size and associated
large heat dissipation requirements, FPGAs with higher gate counts
require large packages with enhanced thermal capabilities. These packages
foten include many more I/O pins than your design actualla needs, and may
require external heat sinks or fans to meet temperature constraints. An
ASIC solution allows you to match the I/O and power requirements of
your design with the appropriate size and type of package. This option can
save board real estate, further reduce the cost of the ASIC, simplify
board layout and routing, reduce or eliminate the need for heat sinks and
additional cooling, and improve the manufacturability and reliability of
individual solutions asic solutions
FPGA development (field programmable gate array)
complete synthesis service
OpenCAD™ design environment
DFT services (Design for Test)
Asic design services
ISSP (Instant Silicon Solution Platform)
FPGA design services
ASIC Packaging Services
FPGA to Gate Array conversion