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ASIC Packaging - Services & Solutions
FPGA to ASIC Conversion
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ASIC Packaging - Services from Electronics
Good design would not be complete without the packaging to match.
offers asic packaging services.
These packages combine outstanding electrical and thermal
properties with a reasonable price tag - thus supporting low-cost
applications and high-end systems.
Advantages of a package - why do asics need
The many different functions of semiconductor
devices are made possible by integrated circuits. If these chips could be
used in unmodified form, packaging
would be unessary. Silicon chips are very delicate and even a tiny
speck of dust or drop of water can hinder their function. Light can also
cause malfunctions. Therfore silicon chips are protected by packaging.
Nowadays, high value-added packaging technologies such as SiP (System in a
Package) are available. The role of SiP goes beyond "protecting" and is
now a mandatory technology for high function products, and a critical
factor in customer purchasing decisions.
Functions of Packages
Protecting the chip from the external
Enabling electric contivity
individual solutions asic solutions
DFT services (Design for Test)
FPGA development (field programmable gate array)
complete synthesis service
asic packaging services
semiconductor packaging services
Asic design services
ISSP (Instant Silicon Solution Platform)
FPGA design services
OpenCAD™ design environment
ASIC Packaging Services
FPGA to Gate Array conversion